Copper busbar manufacturers talk about the development of the electrolytic copper foil industry.-Jiangsu Xindake Connection Technology Co., Ltd.

Copper busbar manufacturers talk about the development of the electrolytic copper foil industry.

Source: http://www.kingdco.com/en/news/117.html Published: 2018-01-22

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Electrolytic copper foil, in English referred to as electrodeposited copper foil, is an important material for the manufacture of copper-clad laminates (CCL) and printed circuit boards (PCB). In today's rapidly developing electronics and information industry, electrolytic copper foil is called the 'neural network' for electronic products to transmit signals and power, and to communicate. Since 2002, China's production value of printed circuit boards has ranked third in the world. As the substrate material for PCBs, copper-clad laminates have also made China the third largest producer in the world. This has led to rapid development of China’s electrolytic copper foil industry in recent years. To understand and recognize the past and present development of the world and China’s electrolytic copper foil industry, and to look forward to the future, experts from the China Epoxy Resin Industry Association have made a review of its development.
From the perspective of the production layout and market development changes in the electrolytic copper foil industry, its development process can be divided into three major periods: the period when the first world copper foil enterprises were established in the United States and the electrolytic copper foil industry began; the period when Japanese copper foil enterprises completely monopolized the world market; and the period of multipolar global competition for the market.
1. The period of establishing the first world copper foil enterprise and the beginning of the electrolytic copper foil industry in the United States (1955–1970s)
In 1922, Edison in the United States invented a patent for the continuous production of thin metal nickel foil, becoming a pioneer of modern continuous electrolytic copper foil manufacturing technology. According to experts from the China Epoxy Resin Industry Association (www.epoxy-e.cn), this patent involves forming metal nickel foil through electrolysis by passing the electrolyte under the lower part of a rotating cathode roller and through a semi-circular arc-shaped anode. The foil adheres to the surface of the cathode roller, and when the roller emerges from the liquid surface, the obtained metal nickel foil can be continuously peeled off and rolled up.
In 1937, the Anaconde Copper Company in Perth Amboy, New Jersey, USA, successfully developed industrially produced electroplated copper foil products using the Edison patent principles and technological approaches mentioned above. They used an insoluble anode to 'generate acid electrolysis' and 'dissolve and deposit copper,' achieving a continuous production of electrolytic copper foil with copper ion balance. The creation of this method was more convenient than producing copper foil by rolling, so at that time, it was widely used as a building material for moisture protection in construction and decoration purposes.
In 1955, Engineer Yates, who had developed and designed electrolytic copper foil equipment at Anaconda Company, and Dr. Adler left the company and independently founded Circuitfoil Company (abbreviated as CFC, later referred to as Yates Company). Yates Company subsequently established electrolytic copper foil factories in New Jersey and California in the United States, as well as in the United Kingdom. In 1957, Clevite and Gould Companies also spun off from Anaconda Company. They also began producing electrolytic copper foil for printed circuit boards. Later, Gould Company established electrolytic copper foil factories in Germany (then West Germany), Hong Kong, Ohio, Arizona in the United States, and the United Kingdom to supply copper-clad laminates and PCB production. By the late 1950s, Gould Company had become the world's largest producer of electrolytic copper foil.
In 1958, Japan's Hitachi Chemical Company and Sumitomo Bakelite Company (both major CCL manufacturers in Japan) jointly established Nihon Electrolytic Company. Subsequently, Fukuda Metal Foil Powder Industries Co., Ltd. (referred to as Fukuda), Furukawa Electric Co., Ltd. (referred to as Furukawa Electric), and Mitsui Mining & Smelting Co., Ltd. (referred to as Mitsui) successively set up electrolytic copper foil production plants, forming Japan's PCB electrolytic copper foil industry. At that time, Japanese copper foil manufacturers used a batch-type electrolysis method: utilizing electroforming technology, a copper cyanide plating bath, and stainless steel polar rollers, with electrolytic copper serving as the soluble anode. This relatively low-efficiency production method allowed the entire country to produce only a few thousand meters of thin copper sheets per month.
In the 1960s, PCBs had gradually become widespread in various fields of the electronics industry, and the demand for copper foil rapidly increased.
According to experts from the China Epoxy Resin Industry Association (www.epoxy-e.cn), in 1968 Mitsui introduced the technology for manufacturing copper foil through continuous electrolysis from the American Anaconda Company for the first time, and produced this electrolytic copper foil at a factory in Ageo Town, Saitama Prefecture.
Furukawa Electric Co., Ltd. also introduced copper foil production technology from the American company CFC. The copper foil production plant established by Furukawa Electric in Tochigi Prefecture, Japan, was completed and began production in 1972. In addition, Nippon Denkai Co. and Fukuda Co. utilized independently developed continuous electrolytic copper foil technology and copper foil surface treatment technology, which were also established in the 1970s, and began industrialized production of electrolytic copper foil. In the early 1970s, several major copper foil manufacturers in Japan achieved significant technological and production advancements.
In the early 1960s, our country’s Benxi Alloy Plant (now Benxi Copper Foil Plant), Northwest Copper Processing Plant (now Baiyin Huaxia Electronic Materials Co., Ltd.), and Shanghai Smelting Plant (now Shanghai Jinbao Copper Foil Co., Ltd.) relied on their independently developed technology to pioneer the production of electrolytic copper foil for PCB in China. By the early 1970s, large-scale continuous production of raw foil products was already possible. During that period, the roughening technology for copper foil mainly relied on processing by a few domestic copper-clad laminate manufacturers. In the late 1960s, the Beijing Insulation Material Factory was the first to successfully develop the 'anodic oxidation' roughening method. After achieving roughening treatment on rolled copper foil, it was subsequently implemented on electrolytic copper foil as well. In the early 1980s, the copper foil industry in mainland China achieved surface roughening technology for electrolytic copper foil via cathodic treatment.
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